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| | | | | | | | | | | | | | | | | | | | | | | | | | | Packaging and Development |
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The AMD64 core provides leading-edge 32-bit performance and support
for future 64-bit applications
- AMD64 technology provides full speed support for x86 code base for exceptional
32-bit performance, with readiness for 64-bit applications
- 40-bit physical addresses, 48-bit virtual addresses
- Eight new (sixteen total) 64-bit integer registers
- Eight new (sixteen total) 128-bit SSE/SSE2 registers
- Including support for 3DNow!™ Professional technology and SSE2
Enhanced Virus Protection with the upcoming Windows® XP SP2
- Enhanced Virus Protection together with the upcoming Windows XP Service Pack 2 are designed to prevent the spread of certain viruses, like MSBlaster and Slammer; significantly reducing the cost and down-time associated with similar viruses and improving the protection of computers and personal information against certain PC viruses
A high-bandwidth, low-latency integrated DDR memory controller
- Supports PC3200, PC2700, PC2100 or PC1600 DDR SDRAM
- Unbuffered SO-DIMMs
- 72-bit DDR SDRAM memory (64-bit interface + 8-bit ECC)
- Up to 3.2 GB/s memory bandwidth
- ECC protection enables increased system reliability
HyperTransport™ technology for high speed I/O communication
- One 16-bit link supporting up to 1600MHz (1600MT/s)
- Up to 6.4GB/s peak HyperTransport I/O bandwidth
Large high performance on-chip cache
- 64KB Level 1 instruction cache
- 64KB Level 1 data cache
- Up to 1MB Level 2 cache
- Improved branch prediction for greater accuracy in anticipating instruction
calls
- Enhanced TLB structures for better memory management of complex workloads
AMD PowerNow!™ technology for advanced power management
- Maximizes your notebook’s battery life
- Provides performance on demand when required by the application
- Allows notebook to run quieter
Wireless Compatibility
- Fully compatible with currently available 802.11 a, b and g wireless
solutions
- AMD enables a choice of best-in-class wireless solutions
Packaging: 754-pin lidless micro PGA, organic package. Die size: Approximately
105.9 million transistors on 193mm2. Processors are manufactured using AMD's
state-of-the-art 0.13-micron SOI technology at AMD's Fab 30 wafer fabrication
facility in Dresden, Germany.
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