High Performance Architecture for the Ultimate in Notebook Computing
The Mobile AMD-K6®-III+ family of processors is built on AMD's advanced 0.18-micron technology and offers a high performance notebook computing experience. Based on an advanced x86, sixth-generation architecture-with a large 256KB high-speed on-chip L2 cache and support for AMD's innovative TriLevel Cache™ design-the Mobile AMD-K6-III+ processor is available in clock speeds up to 500 MHz.
PowerNow!™ Technology for Extended Battery Life
The Mobile AMD-K6-III+ processor enables extended system battery life with PowerNow!™ technology. PowerNow! technology allows the processor to operate at different frequencies and voltages depending on the user's need for maximum performance or maximum battery life. The processor will run at maximum performance when on AC power and automatically drop into a lower power, battery-saver state when battery operated. The user, however, always has the choice of running in either mode through use of a simple Microsoft® Windows® control panel. PowerNow! technology allows system battery life to be significantly extended, depending on the system implementation.
TriLevel Cache™ Design
The Mobile AMD-K6-III+ processor's innovative TriLevel Cache® design enables the largest high-speed cache sub-system in the industry, including a 64KB L1 cache, an on-chip 256KB L2 cache operating at full processor speed, and up to 1MB of L3 cache on the external 100MHz front-side bus.
Advanced Super7™ Platform Features
The Mobile AMD-K6-III+ processor supports other advanced Super7™ platform features, including a 100MHz front-side bus for faster memory and I/O performance, PC-100 SDRAM and 2X AGP graphics.
3DNow!™ Technology for better 3D Multimedia, Audio and Graphics
AMD has shipped millions of AMD-K6 family processors with 3DNow!™ technology, revolutionizing the 3D experience with up to four times the peak floating-point performance of previous generation solutions. AMD was the first to bring this advanced technology to notebook computing with the Mobile AMD-K6-2 processor, and 3DNow! technology has widespread support from Microsoft® and the x86 software developer community. The Mobile AMD-K6-III+ processor includes an enhanced version of 3DNow! technology, with new instructions designed to support digital signal processing (DSP) functions in applications such as MP3 recording, Dolby Digital and Surround Sound processing and soft xDSL modems.
Lower Cost of Ownership
AMD continues to lead the mobile industry in offering the best system performance for the price. Whether you are a large corporate user or an individual business buyer, you can now have premium performance at an affordable price.
Compatible with the Windows® Universe
If it's from AMD, it's compatible. The Mobile AMD-K6-III+ processor has undergone extensive testing to confirm compatibility with Windows 98, Windows NT®, Windows 2000 and other leading operating systems. The Mobile AMD-K6-III+ processor is also compatible with more than 60,000 software applications, including the latest 3DNow! and MMX® technology-enhanced software. As the world's second largest supplier of processors for the Windows environment, AMD has shipped more than 50 million Windows compatible CPUs in the last five years.
Mobile AMD-K6®-III+ Processor Features
- High processor clock speeds - up to 500 MHz today
- Six-issue RISC86® superscalar microarchitecture
- Advanced TriLevel Cache design for improved system performance
- Large 64KB on-chip L1 cache
- 256KB on-chip backside L2 cache operating at full processor speeds
- Support for off-chip L3 cache of up to 1MB
- PowerNow! technology for extended notebook system battery life
- 100MHz front-side bus for fast system memory and I/O access
- 3DNow! Technology with new instructions for digital signal processing
- Superscalar MMX technology for a rich multimedia experience
- Low-voltage, 0.18-micron, 5-layer-metal silicon process technology with reduced power consumption for mobile computing