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| | | | | | | | | | | | | | | | | | | | | | | | Packaging and Development |
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Development Activities
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Planning
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Status: Completed
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Phase 1: Evaluation of Current Packages and Materials
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Status: Completed
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- Assessment of current packages with 260°C reflow (complete)
- Include material and device compatibility
- Use NEMI reflow profile for preconditioning
- Selection of packages for evaluation (17 types)
- Package reliability testing
- Failure analysis
- Assessment of Pb-free lead finish options complete
- Available plating processes
- Compatibility with eutectic and Pb-free board assembly
- Cost and feasibility of implementation
- Assessment of Pb-free solderball options complete
- Assessment of subcontractor strategy and readiness
- Recommend options for production development
Phase 2: Development of Fully Pb-free Packages
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Status: Completed
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- Defined development plan
- Identified material changes required
- Defined new solderball/leadfinish candidates
- Defined reliability requirements
- Developed manufacturing processes
- Demonstrated capability for package qualification
- Report on study of surface finish effect on solder joint reliability (EPTC 2004)
Phase 3: Production Implementation
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Status: Completed
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- Production facility equipment changeover began in Q2 2005
- Production transition to Pb-reduced manufacturing for microprocessor and chipset products began July 2005
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