As processor technology pushes to faster speeds and higher performance, thermal management becomes increasingly crucial when building computer systems. Maintaining the proper thermal environment is key to reliable, long-term system operation. The overall goal in providing the proper thermal environment is keeping the processor below its specified maximum case temperature. Heatsinks induce improved processor heat dissipation through increased surface area and concentrated airflow from attached fans. In addition, interface materials allow effective transfers of heat from the processor to the heatsink. For optimum heat transfer, AMD recommends the use of thermal grease and mounting clips to attach the heatsink to the processor.

When selecting a thermal solution for your system, please refer to the following collection of heatsinks evaluated and recommended by AMD for use with AMD processors. Note, the following heatsinks are recommended for maintaining the specified Maximum Tcase requirement. In addition, this collection is not intended to be a comprehensive listing of all heatsinks that support AMD processors.

For more information on how to implement a proper thermal environment in your PC system, see the AMD-K6® Processor Thermal Solution Design Application Note, order# 21085

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